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首页进口晶振台湾加高晶体X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振

X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振

规格型号：74136657
频率：26MHz
尺寸：2520mm
PDF
产品描述：X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振，特点：微型超薄SMD产品尺寸（2.52.00.5max）。高精度、可靠性高，耐热性好。针对射频应用、无线模块设备、RFID应用和其他基于消费者的产品的优化解决方案。台湾加...

X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振，特点：微型超薄SMD产品尺寸（2.5×2.0×0.5 max）。高精度、可靠性高，耐热性好。针对射频应用、无线模块设备、RFID应用和其他基于消费者的产品的优化解决方案。台湾加高晶振公司，HELE晶振，高品质晶振，SMD晶振，石英晶振，无源晶振，高精度晶振，6G通讯设备晶振，无线传输晶振，局域网晶振，2520晶振，小体积晶振，低损耗晶振，北斗卫星定位模块晶振

X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振

项目	HSX221SA
频率范围	12~24MHz	24~30MHz	30~54MHz
工作模式	Fundamental
频率容差	±7ppm ~ ±50ppm (at. 25℃ ) , or Specify
温度范围内的频率稳定度	±10ppm, ±15ppm, or Specify
工作温度	-10 ~ +60 ℃ , or Specify
负载电荷	Series, 8pF, 10pF, 12pF, or Specify
驱动电平	10μW (100μW Max.)
等效串联电阻	150ΩMax.	80ΩMax.	60ΩMax.
储存温度范围	‘-40 ~ +125℃

X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振

原厂编码	生产商	型号	频率	频率容差	负载电容	工作温度
X2B026000M81H-HS	加高晶振	HSX221SA	26 MHz	±7ppm	8pF	-
X2B016000BA1H-U	加高晶振	HSX221SA	16 MHz	±10ppm	10pF	-30°C ~ 85°C
X2B012000BC1H-U	加高晶振	HSX221SA	12 MHz	±10ppm	12pF	-40°C ~ 105°C
X2B040000BC1H-DHZ	加高晶振	HSX221SA	40 MHz	±10ppm	12pF	-30°C ~ 85°C
X2B012000B91H-U	加高晶振	HSX221SA	12 MHz	±10ppm	9pF	-20°C ~ 70°C
X2B012000DC1H-X	加高晶振	HSX221SA	12 MHz	±20ppm	12pF	-10°C ~ 60°C
X2B016000B91H-HU	加高晶振	HSX221SA	16 MHz	±10ppm	9pF	-20°C ~ 70°C
X2B016000BC1H-HV	加高晶振	HSX221SA	16 MHz	±20ppm	12pF	-20°C ~ 75°C
X2B019200BZ1H-CHZ	加高晶振	HSX221SA	19.2 MHz	±12ppm	7pF	-30°C ~ 85°C
X2B024000BC1HA-V	加高晶振	HSX221SA	24 MHz	±20ppm	12pF	-20°C ~ 75°C
X2B024000BC1H-HV	加高晶振	HSX221SA	24 MHz	±30ppm	12pF	-30°C ~ 85°C
X2B024000BCIH-HV	加高晶振	HSX221SA	24 MHz	±30ppm	12pF	-40°C ~ 85°C
X2B024000FK1H-V	加高晶振	HSX221SA	24 MHz	±30ppm	20pF	-20°C ~ 75°C
X2B025000BI1H-U	加高晶振	HSX221SA	25 MHz	±20ppm	18pF	-40°C ~ 85°C
X2B026000B71HZ-HPR	加高晶振	HSX221SA	26 MHz	±10ppm	7.2pF	-20°C ~ 75°C
X2B026000B81H-CHZ	加高晶振	HSX221SA	26 MHz	±11ppm	8pF	-30°C ~ 85°C
X2B026000B91H-HR	加高晶振	HSX221SA	26 MHz	±10ppm	9pF	-20°C ~ 75°C
X2B026000B91H-HV	加高晶振	HSX221SA	26 MHz	±15ppm	9pF	-20°C ~ 75°C
X2B026000B91H-HZ	加高晶振	HSX221SA	26 MHz	±10ppm	9pF	-30°C ~ 85°C
X2B026000B91H-U	加高晶振	HSX221SA	26 MHz	±20ppm	9pF	-40°C ~ 85°C
X2B026000L91H-S	加高晶振	HSX221SA	26 MHz	±12ppm	9pF	-20°C ~ 75°C
X2B026000B71HZ	加高晶振	HSX221SA	26 MHz	±10ppm	11.5pF	-10°C ~ 60°C
X2B026000BC1H-Z	加高晶振	HSX221SA	26 MHz	±10ppm	12pF	-20°C ~ 85°C
X2B027000BC1H-HU	加高晶振	HSX221SA	27 MHz	±10ppm	12pF	-10°C ~ 70°C
X2B02863ADC1H-W	加高晶振	HSX221SA	28.6363 MHz	±20ppm	12pF	-20°C ~ 70°C
X2B030000BA1H-HW	加高晶振	HSX221SA	30 MHz	±20ppm	10pF	-20°C ~ 70°C
X2B030000BA1H-U	加高晶振	HSX221SA	30 MHz	±10ppm	10pF	-20°C ~ 70°C
X2B030000FA1H-X	加高晶振	HSX221SA	30 MHz	±30ppm	10pF	-20°C ~ 70°C
X2B032000C81H-HU	加高晶振	HSX221SA	32 MHz	±15ppm	8pF	-20°C ~ 75°C
X2B032000D81H-U	加高晶振	HSX221SA	32 MHz	±20ppm	8pF	-30°C ~ 85°C
X2B032000BC1H-HZ	加高晶振	HSX221SA	32 MHz	±12ppm	12pF	-30°C ~ 85°C
X2B038400BA1H-U	加高晶振	HSX221SA	38.4 MHz	±10ppm	10pF	-20°C ~ 70°C
X2B040000B91H-U	加高晶振	HSX221SA	40 MHz	±10ppm	9pF	-20°C ~ 70°C
X2B040000BC1H-DHZ	加高晶振	HSX221SA	40 MHz	±10ppm	12pF	-30°C ~ 85°C
X2B04000BF1H-HZ	加高晶振	HSX221SA	40 MHz	±10ppm	15pF	-30°C ~ 85°C
X2B040000BF1H-HT	加高晶振	HSX221SA	40 MHz	±18ppm	15pF	0°C ~ 85°C
X2B040000BF1H-HZ	加高晶振	HSX221SA	40 MHz	±10ppm	15pF	-30°C ~ 85°C
X2B012000B91H-U	加高晶振	HSX221SA	12 MHz	±10ppm	9pF	-20°C ~ 70°C
X2B016000B91H-HU	加高晶振	HSX221SA	16 MHz	±10ppm	9pF	-20°C ~ 70°C
X2B016000BC1H-HV	加高晶振	HSX221SA	16 MHz	±20ppm	12pF	-20°C ~ 75°C
X2B024000BCIH-HV	加高晶振	HSX221SA	24 MHz	±30ppm	12pF	-40°C ~ 85°C
X2B024000FK1H-V	加高晶振	HSX221SA	24 MHz	±30ppm	20pF	-20°C ~ 75°C
X2B026000B81H-CHZ	加高晶振	HSX221SA	26 MHz	±11ppm	8pF	-30°C ~ 85°C
X2B026000B91H-U	加高晶振	HSX221SA	26 MHz	±20ppm	9pF	-40°C ~ 85°C
X2B030000BA1H-HW	加高晶振	HSX221SA	30 MHz	±20ppm	10pF	-20°C ~ 70°C
X2B030000BA1H-U	加高晶振	HSX221SA	30 MHz	±10ppm	10pF	-20°C ~ 70°C
X2B030000FA1H-X	加高晶振	HSX221SA	30 MHz	±30ppm	10pF	-20°C ~ 70°C
X2B040000BC1H-DHZ	加高晶振	HSX221SA	40 MHz	±10ppm	12pF	-30°C ~ 85°C
X2B040000BF1H-H	加高晶振	HSX221SA	40 MHz	±18ppm	15pF	0°C ~ 85°C

　深圳市金洛电子有限公司
　代理:EPSON,KDS,SEIKO,CITIZEN
　电话:0755-27837162
　手机:13510569637
　邮箱:jinluodz@163.com
　Q Q:657116624
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晶振系列

金洛博客

X2B026000B71HA-HZ晶振,台湾加高晶体,物联网终端晶振

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